The QS32X384 provides a set of twenty high-speed CMOS TTLcompatible bus switches. The low ON resistance of the QS32X384 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Four Bus Enable signals are provided, one for each of five bits of the 20-bit bus. The QS32X384 is ideal for switching wide digital buses, as well as hotplug buffering, and 5V to 3V conversion. The QS32X384 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to VCC
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay
  • Zero ground bounce
  • Undershoot clamp diodes on all switch and control pins
  • Four enables control five bits each
  • TTL-compatible input and output levels
  • Available in 48-pin QVSOP package

Product Options

下單器件 ID Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 封裝 Buy Sample
QS32X384Q1G Active QVSOP 48 C Yes Tube Package Info
Availability
QS32X384Q1G8 Active QVSOP 48 C Yes Reel Package Info
Availability

Documentation & Downloads

文檔標題 他の言語 Type 文檔格式 文件大小
數據手冊與勘誤表
QS32X384 Datasheet Datasheet PDF 281 KB
Errata LEN-02-01: pin swap Errata PDF 100 KB
應用指南 &白皮書
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 417 KB
Quickswitch Basics Application Note PDF 142 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities Product Change Notice PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN# L0203-10R2 Fab 2 to Fab4 Transfer Product Change Notice PDF 112 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
Downloads
QS32X384 IBIS Model Model - IBIS ZIP 9 KB
QS32X384 Hspice Model Model - HSPICE ZIP 5 KB